Aluminum Nitride and Silicon Nitride Ceramic Substrates Enable Efficient Heat Dissipation and Thermal Management Innovation in Power Semiconductors
With the continuous advancement of power semiconductor technology, efficient heat dissipation solutions have become increasingly important, especially in high-power, high-density applications such as electric vehicles, industrial automation, and 5G communication. Ensuring device stability and prolonging its lifespan have become key factors for industry development. In recent years, aluminum nitride (AlN) and silicon nitride (Si₃N₄) ceramic substrates, with their excellent thermal conductivity, high-temperature performance, and electrical insulation properties, have become core technologies in the power semiconductor packaging field. Thermal Conductivity Advantages of Aluminum Nitride and Silicon Nitride Ceramic Substrates Aluminum nitride and silicon nitride ceramic substrates, due to their high thermal conductivity and good mechanical strength, have become ideal choices for […]